Prime Minister Narendra Modi virtually laid the foundation stone for the HCL-Foxconn Joint Venture – India Chip Pvt. Ltd. semiconductor facility at the Yamuna Expressway Industrial Development Authority in Jewar, Greater Noida.
The project marks a major step in India’s push toward technological self-reliance in semiconductor manufacturing.
About the Project
- Joint Venture: HCL Group & Foxconn
- Location: Jewar, Greater Noida, Uttar Pradesh
- Company Name: India Chip Pvt. Ltd.
- Production Capacity: Around 3 crore 60 lakh chips annually
- Sector: Semiconductor fabrication / electronics manufacturing ecosystem
The plant aims to strengthen India’s position as a trusted global hub for high-end electronics and chip manufacturing.
Key Statements by the Prime Minister
- Electronics manufacturing in India has grown nearly six-fold in 11 years.
- Electronics exports increased eight-fold.
- Mobile phone production rose 28 times, while exports surged over 100 times.
- Uttar Pradesh now contributes over 50% of India’s mobile phone manufacturing.
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