India’s First Advanced 3D Semiconductor Packaging Unit

The foundation stone for India’s first advanced 3D chip packaging unit has been laid at Info Valley in Bhubaneswar, marking a major push to strengthen the country’s semiconductor ecosystem.

Project Details

• The project is being implemented by 3D Glass Solutions Inc. (USA) through its Indian subsidiary Heterogeneous Integration Packaging Solutions Pvt. Ltd. (HIPSPL).
• Located in Khordha district, it is a greenfield, vertically integrated advanced packaging and ATMP (Assembly, Testing, Marking and Packaging) facility.
• Focuses on 3D chip packaging and embedded glass substrate technology, a cutting-edge area in semiconductor manufacturing.

Investment and Support

• Total investment: ₹1,943.53 crore
• Central government support: ₹799 crore
• State government support: ~₹399.5 crore

Strategic Importance

• Boosts India’s push for Atmanirbhar Bharat in electronics manufacturing.
• Strengthens domestic capabilities in semiconductor value chains, especially in advanced packaging—a critical but often outsourced segment.

Applications
The facility will cater to high-growth and strategic sectors:

• Data centres
• Artificial Intelligence (AI) & Machine Learning (ML)
• 5G/6G communications
• Automotive radar
• Defence and aerospace electronics
• Photonics

Timeline

• Commercial production: Expected by August 2028

Full-scale production: Targeted by August 2030